Stocks
I
IBM I
Jun 4, 2024, 8:48:56 AM
Rapidus and IBM Collaborate on Advanced Chiplet Packaging Technology for 2nm Semiconductors
TOKYO and ARMONK, NY, June 3, 2024 – Rapidus Corporation, a leader in advanced logic semiconductors, and IBM (NYSE: IBM), a global technology giant, have announced an exciting partnership to develop mass production technologies for chiplet packages. This collaboration builds on their existing agreement for the joint development of 2nm node technology.
Innovative Partnership for 2nm Chiplet Packaging
The new agreement between Rapidus and IBM aims to leverage IBM's state-of-the-art packaging technology for high-performance semiconductors. This initiative is part of the international "Development of Chiplet and Package Design and Manufacturing Technology for 2nm-Generation Semiconductors" project, spearheaded by Japan’s New Energy and Industrial Technology Development Organization (NEDO).
Joint Development Efforts
Engineers from both companies will collaborate at IBM’s North American facilities to advance the R&D and manufacturing of semiconductor packaging for high-performance computer systems. IBM’s extensive experience in semiconductor packaging and joint development partnerships will be instrumental in Rapidus’s goal to establish cutting-edge chiplet packaging technology.
Executive Insights
Dr. Atsuyoshi Koike, President and CEO of Rapidus, expressed enthusiasm about the partnership: “Building on our current joint development agreement for 2nm semiconductor technology, we are extremely pleased to officially announce today this partnership with IBM to establish chiplet packaging technology. We will make the most of this international collaboration and pursue initiatives that will allow Japan to play an even more important role in the semiconductor packaging supply chain.”
Darío Gil, SVP and Director of Research at IBM, commented: “With decades of innovation in advanced packaging, IBM is honored to expand our collaboration with Rapidus to develop state-of-the-art chiplet technology. Through our agreement, we are committed to supporting the development of the most advanced node production processes, design, and packaging, as well as developing new use cases and supporting the semiconductor workforce.”
About Rapidus
Rapidus Corporation specializes in developing and manufacturing the world’s most advanced logic semiconductors. By offering services that reduce cycle times for design, wafer processes, 3D packaging, and other aspects of semiconductor production, Rapidus aims to create new industries and enhance the quality of life through innovative semiconductor technology.
(Source: IBM)